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Semiconductor Equipment Corporation
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Model number:EMSE-00006
Product Name:Semiconductor equipment
Area Made:USA
Explanation:Hot Gas Rework Station Removes Surface Mounted Components And Bonded Die. Using carefully regulated heat controls, quickly and easily removes surface mounted components and bonded die from PC boards, hybrid micro-circuits and packages without disturbing nearby components or damaging the removed device.
Model number:EMSE-00005
Product Name:Semiconductor equipment
Area Made:USA
Explanation:The Model 830 is a general purpose pick and place system for die and surface mount components. The 830 offers manually or pneumatically controlled Z motion with semiautomatic vacuum pickup tool movement for transferring die and other small devices from tape or carrier trays to packages.
Model number:EMSE-00004
Product Name:Semiconductor equipment
Area Made:USA
Explanation:Semiconductor Equipment Corporation's Model 3100 & 3150 Wafer/Film Frame Tape Applicators apply tape with optimal control of temperature and pressure parameters. Uniform, bubble-free mounting of tape for wafer dicing is the result. State-of-the-art features make them two of the most advanced systems available. The Model 3100 handles wafers up to 6" in diameter, while the Model 3150 handles any size wafer up to 8" in diameter. Both models are so versatile, they can operate with virtually any film frame.
Model number:EMSE-00003
Product Name:Semiconductor equipment
Area Made:USA
Explanation:The Model HS-1810 Die Matrix Expander is a semiautomatic system capable of expanding 6¡¨ or 8¡¨ wafers, which are diced or scribed and mounted on dicing tape and film frame. The transfer carrier is to interlocking grip rings and the system is capable of various temperature, stroke and speed setting for optimum control.
Model number:EMSE-00002
Product Name:Semiconductor equipment
Area Made:USA
Explanation:Semiconductor Equipment Corporation's New Model 860 Eagle is a multi-use semiautomatic system ideal for R & D and low volume production. Applications include solder and gold bumped flip chip, eutectic bonding including laser diodes and bars and epoxy bonding. Some of the process capabilities that support these applications are ultrasonic, thermosonic, scrub, flux dipping and hot gas spot heating. The new system is designed for maximum versatility and ease of operation.
Model number:EMSE-00001
Product Name:Semiconductor equipment
Area Made:USA
Explanation:Semiconductor Equipment Corporation´s Model 850 is a versatile, semi-automatic placement system for flip chips, chip scale devices and bare die. The system is intended for low volume production and development projects requiring accuracies of +/- 12 microns. A typical application consists of a cycle in which devices are picked up from a waffle pack, dipped into flux and then placed on a substrate.
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Contact Details
Email:sales@semicorp.com
Key Contact
Tel:(805) 529-2293
Email:sales@semicorp.com
Fax:(805) 529-2193
Name:Yuki
Professional title:Service personnels
Address:5154 Goldman Ave. Moorpark, CA 93020